Ad-hoc | 19.06.2007 HTI - EUR 20 million corporate bond for further growth

Neudörfl, June 19, 2007. The stock listed HTI High Tech Industries AG announces the issue and the private placement of a bond in the amount of EUR 20 million.

“The successful placement of the corporate bond with institutional investors together with the existing funds of the Group form a solid basis for the further growth steps of the HTI. This is a further sign of confidence of the capital market in our business model”, underlines DI Peter Glatzmeier, member of the Management Board of the HTI AG.

The placement of the bond took place under the lead management of Raiffeisen Zentralbank Österreich AG.

Contacts:
HTI High Tech Industries AG

Dipl. Ing. Peter Glatzmeier
Member of the Management Board
Phone + 43 (0) 3862 304-8590
p.glatzmeier@hti-ag.at

Mag. Birgit Hochenegger-Stoirer
Member of the Management Board
Phone +43 (0) 2622 460-1105
Fax +43 (0) 2622 460-1102
b.hochenegger@hti-ag.at
 

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